Ningbo ChipEx Semiconductor Co., Ltd was established in January 2013 with a total investment of 280 millions, and located in Hangzhou-Bay New Zoon, Ningbo (Exit of Hangzhou-Bay Bridge). ChipEx focused on Wafer Level CSP、FC-Bumping and other related business, also provide wafer testing, packaging design, packaging and testing for customers from local and overseas. Products are widely used in smart phones, tablet PCs, wearable electronic devices and other electronic products, expand to energy saving and environmental protection, intelligent home, bio-medical, networking automotive electronics and so on.
ChipEx strengthen the sense of quality, with excellent quality and perfect service to meet customers’ needs, and passed ISO9001, ISO14000 and QC080000 certification.
ChipEx’s purpose is to make the customers’ satisfaction with the quality, delivery, cost and service for the advanced IC packaging, and continuously improve the quality and technological innovation to meet customers’ needs, making the company developing rapidly.