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          Service

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          NINGBO CHIPEX SEMICONDUCTOR CO.,LTD

          Add:No.18 Zhongheng Road,Huaxing District,Andong Industrial Park,Hang Zhou Bay New Zone,Ningbo

          P.O:315327

          Mail:sales@chipex.cn

          Tel:(86)-574-63078606;

                    (86)-574-63078608-8858


          Service

          Current Location: Home >> Service >> Product

                Providing wafer-level packaging services including wafer-level chip-scale packaging, plating solder, copper bump process, RDL and so on.

                Providing variety of flip-chip packaging and packaging line including QFN, DFN, SOT, SOP, LGA and BGA, etc to the traditional packaging factories cooperated.



          A. Wafer Level Package


          未標題-1.jpg


          PackageSolder BumpPillar BumpWLCSPRDL
          Wafer Size6and 8 inch
          UBMTi/Cu
          MaterialSolderCu/Sn,Cu/SnAGLeadfreeAl,Cu,Ni/Pd/Au,Ni/Au
          Min.Pitch
          150um90um300umL/S:10/10um
          RepassivationPl,SMF,LowTem.Pl,PBO


          B. Flip Chip Package


          Package Type:LGA/BGA,QFN,DFN,SOT,SOP can be provided by ChipEx and assembly packing partners.




          C. Product Features




          俄罗斯人与动牲交ZOOZ,欧洲美女与动交Z0Z0Z,俄罗斯胖老太与人牲交