俄罗斯人与动牲交ZOOZ,欧洲美女与动交Z0Z0Z,俄罗斯胖老太与人牲交

<sub id="7jlzt"><delect id="7jlzt"><em id="7jlzt"></em></delect></sub>

<nobr id="7jlzt"></nobr>
    <nobr id="7jlzt"></nobr><progress id="7jlzt"></progress>

      <mark id="7jlzt"></mark>

      <form id="7jlzt"><i id="7jlzt"><ins id="7jlzt"></ins></i></form>

      <span id="7jlzt"></span>
      <b id="7jlzt"><del id="7jlzt"></del></b>
          <address id="7jlzt"></address>

          News

          Hot Keywords

          Contact us

          NINGBO CHIPEX SEMICONDUCTOR CO.,LTD

          Add:No.18 Zhongheng Road,Huaxing District,Andong Industrial Park,Hang Zhou Bay New Zone,Ningbo

          P.O:315327

          Mail:sales@chipex.cn

          Tel:(86)-574-63078606;

                    (86)-574-63078608-8858


          Semiconductor packaging and testing process

          Current Location: Home >> News >> IU.

          Semiconductor packaging and testing process

          The package process is: cutting into small wafers by a dicing process after the front process, then glued on the corresponding substrate rack, making bond pads of the wafers connecting with the corresponding leads of the substrate by using ultra-fine metal wire or conductive resin and constitute the required circuit. And then separate the chip with a plastic shell to protect the package, after plastic, but also a series of operations, such as post-curing, cutting tendons and molding, plating and printing technology. After the completion of packaging products for inspection, testing and packaging processes and then finally inbound shipping. Typical packaging process including: dicing, loading, bond, plastic package, edge removing, plating, print, trim and form, visual inspection, product testing, packaging and shipment.

          俄罗斯人与动牲交ZOOZ,欧洲美女与动交Z0Z0Z,俄罗斯胖老太与人牲交