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          Technology

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          NINGBO CHIPEX SEMICONDUCTOR CO.,LTD

          Add:No.18 Zhongheng Road,Huaxing District,Andong Industrial Park,Hang Zhou Bay New Zone,Ningbo

          P.O:315327

          Mail:sales@chipex.cn

          Tel:(86)-574-63078606;

                    (86)-574-63078608-8858


          CuPillar

          Current Location: Home >> Technology >> CuPillar

              Copper pillar process is making copper-tin bumps on the surface of the chip for "point-of-connection" between the chips or the chips and the substrates by utilizing gluing, litho, electroplating and etching process and other production technology through the surface of the chip in the production of copper and tin bumps after wafer processing of the substrate circuit. The array of bumps on the die surface allows pin density to be higher due to the elimination of the traditional "wire bonding" to the surrounding metal, reducing the area of the chip to meet the performance requirements of the chip, low resistance, low parasitic capacitance, low inductance, low power consumption, low signal-to-noise ratio, low cost, and so on.



          Cu-Pillar StructurePI ThicknessStandard Cu-PillarMicro Cu-Pillar

          1M

          (Dirctl Cu-Pillar)

          NA

          Pitch:150um

          Bump Size:80-100um

          Bunp Height:

          65um Cu+35um Sn

          Min.Pitch:90um

          Min.Bump Size:45um

          Bum Hemp:

          25um Cu+20um Sn

          1P1M

          (PI+Cu-Pillar)

          5um

          1P2M

          (PI+RDL+Cu-Pillar)

          5um

          2P2M

          1st PI+RDL+2ndPI+Cu-Pillar

          1st PI5um

          2ndPI 10um 



          1458266642377033.jpg

          Application:

          PMU.Smart.Card.RF.PA.MEMS&Sensor.ucontrollers.EEPROM/Dram/Flash/SRAM


          1458269032803537.jpg



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