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          Technology

          Hot Keywords

          Contact us

          NINGBO CHIPEX SEMICONDUCTOR CO.,LTD

          Add:No.18 Zhongheng Road,Huaxing District,Andong Industrial Park,Hang Zhou Bay New Zone,Ningbo

          P.O:315327

          Mail:sales@chipex.cn

          Tel:(86)-574-63078606;

                    (86)-574-63078608-8858


          WLCSP

          Current Location: Home >> Technology >> WLCSP

                 Wafer Level Chip Scale Packaging is different from the traditional chip package (Sawing before packaging and testing, and the volume will be increased at least 20% than the original chip). This latest technology is firstly film deposited on the wafer, then litho, electrochemical deposition, packaging and testing will be go on, at last been sawed into the same size die as the chip scale, without going through the wire and filling process, the chip size is almost the same as bare chip after packaging. Packaging efficiency close to 100%, in line with consumer electronics products’ market trend of light, small, short and thin, and has a large density, low induction, low cost, good heat dissipation and so on. The advantages of packaging are more obvious while wafer size increases and die size decreases.



          CSP Structure PI Thickness

          UBM Thickness

          Other

          1P1M

          (PI+U+CSP)

          5um/10um

          8um

          Min.Ball Pitch:0.3mm

           Min.Ball Size: 0.15mm

          Min.PI Opening:30um

          Min.Trace Line X Space:10X10um 

          2P1M

          (PI+RDL+PI+CSP)

          1st PI 5um

          2nd PI 10um

          8um

          2P2M

          (PI+RDL+PI+UBM+CSP)

          1st PI 5um

          2nd PI 10um

          RDL:5um

          UBM:8um

          3P3M

          (PI+RDL+PI+RDL+UBM+CSP)

          1st PI 5um

          2nd/3rd PI 10um

          RDL:5um

                    UBM:8um     



          Pitch

          (um)

          Product TypeBump Height(um)Bump Diameter(um)UBM Size(um)
          3001P1M/2P2M100±20180±20180
          2P1M100±20165±20160
          4001P1M/2P2M195±20270±20240
          2P1M200±20260±20210
          5001P1M/2P2M235±20320±20280
          2P1M235±20310±20240
          600
          1P1M/2P2M280±20370±20320
          2P1M280±20360±20300

               Application:


               IPD,PMU,Local Power,VCM Driver,Switch,Audio& Video,EEPROM,MEMS&Sensor,PA


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