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          Technology

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          NINGBO CHIPEX SEMICONDUCTOR CO.,LTD

          Add:No.18 Zhongheng Road,Huaxing District,Andong Industrial Park,Hang Zhou Bay New Zone,Ningbo

          P.O:315327

          Mail:sales@chipex.cn

          Tel:(86)-574-63078606;

                    (86)-574-63078608-8858


          Plating Solder

          Current Location: Home >> Technology >> Plating Solder

                 Electroplating solder Technology is making tin bumps on the chip pads by series processes such as coating, litho, electroplating and etching, and then using high temperature melting the bumps and been packaged, the IC size can significantly be reduced by this technology, and has a high density, low induction, low cost, good heat dissipation and so on. Wafer-level chip scale packaging is generally applicable to large-size solder balls placed on large pads and the solder technology applied in the manufacture of fine pitch and ultra-thin package of the small tin ball way. This technology successfully applied to flip and reflected its superiority.


          Solder Bump StructurePl ThicknessUBM ThicknessOther

          1M

          (UBM+Solder Bump)

          NA8um Cu+Sn

          Min.Bumo Pitch:0.15mm

          Min.Ball Size:0.08mm

          Min.Ball Height:0.020mm

          Min.PI Opening:30um

          Min.Trace Line X Space:10X10UM


          1P1M

          (PI+UBM+Solder BUMP)

          5um8um Cu+Sn

          2P2M

          (1st PI+RDL+2ndPI+

            UBM+Solder Bump)


          1st PI 5um

          2nd PI 10um

          RDL:5um Cu UBM:8um Cu+Sn

          APPlication:

          Smart Card,VCM Driver,Switch,Audio& Video,EEPROM/Flash/SRAM,MEMS&Sensor,ucontrollers


          1457924437520371.png


          a. Standard Turnkey process: Min. BG thickness 200um, T/R shipment;


          1458272849948608.jpg


          b. Special process: Min. BG thickness 60um, Wafer ring shipment.


          俄罗斯人与动牲交ZOOZ,欧洲美女与动交Z0Z0Z,俄罗斯胖老太与人牲交