俄罗斯人与动牲交ZOOZ,欧洲美女与动交Z0Z0Z,俄罗斯胖老太与人牲交

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          Technology

          Hot Keywords

          Contact us

          NINGBO CHIPEX SEMICONDUCTOR CO.,LTD

          Add:No.18 Zhongheng Road,Huaxing District,Andong Industrial Park,Hang Zhou Bay New Zone,Ningbo

          P.O:315327

          Mail:sales@chipex.cn

          Tel:(86)-574-63078606;

                    (86)-574-63078608-8858


          0201技術

          Current Location: Home >> Technology >> 0201

                Making TVS devices by using Wafer-Level Packaging technology can obviously reduce device size and significantly improve electrical performance and reliability, shorten the package time and lower cost, which was widely used in mobile phones, MP3 players, PDAs and digital cameras and other portable electronic products to provide protection and improve its reliability.




          ltem

          Standard

          Other

          Die Size Without Dicing Street

          570x270um

          NA

          Dicing Street

          60um

          No metal allowed in the dicing street

          Bump pitch

          400um within

          Follow customer requirement

          Bump Size

          120X210um

          Follow customer requirement

          Bump Height

          11um(Cu 8um+Sn 3um)

          Only Bake and no feflow allowed

          BG Thickness

          265um

          Follow customer requirement




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          俄罗斯人与动牲交ZOOZ,欧洲美女与动交Z0Z0Z,俄罗斯胖老太与人牲交